NPTEL Sensors and Actuators Week 11 Assignment Answers 2025
1. Evaluate whether the statement is true or false:
“Strain gauge is a passive device that converts an electrical signal into a change of resistance.”
- True
- False
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2. Choose one option that best suits SU8 photoresist:
- Spin coatà soft bake @90 degC à UV exposure à Hard bake @120 degC
- Spin coatà soft bake @120 degC à UV exposure à Hard bake @90 degC
- Spin coatà soft bake @65 degC à UV exposure à Hard bake @95 degC
- Spin coatà soft bake @95 degC à UV exposure à Hard bake @65 degC
Answer :-
3. Complete the following statement: “PEDOT: PSS is a ___________, which was used to make piezo resistor during the fabrication of flexible sensor.”
- Semiconducting material
- Non-conducting polymer
- Conducting polymer
Answer :-
4. Complete the following statement: “In photolithography, when we use a bright field mask and when there is a positive photoresist, the area which is not exposed to UV light will ____________.”
- Get stronger
- Have no effect
- Get weaker
Answer :-
5. Which technique makes a 3D model from a 2D drawing in Autodesk Inventor?
- Protrusion
- Elongation
- Extrusion
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6. Argon gas is used in the sputtering process. What is the reason behind this?
- Argon is chemically inert and prevents surface oxidation or any unwanted reaction.
- Argon is a heavier molecule, and this facilitates faster surface modification.
- Argon is relatively cheaper when compared to lighter noble gases.
- All of the above
Answer :-
7. Evaluate whether the below statement is true or false:
“Thermal and e-beam evaporation are physical vapor deposition (PVD) techniques.”
- True
- False
Answer :-
8. Complete the following sentence:
“The CAD software demonstrated in the 3D-modeling session was ……………”
- FUSION 360
- INVENTOR
- REVIT
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9. When a flexible sensor was fabricated for phenotyping tissue properties, which technique was used for PDMS deposition on the substrate?
- Electrospinning
- Physical vapor deposition
- Spin coating
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10. What is the use of a high vacuum in the chamber while performing physical vapor deposition (PVD)?
- To increase the mean free path
- To decrease the mean free path
- To increase the deposition rate
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