NPTEL Sensors and Actuators Week 8 Assignment Answers 2025
1. Which of the following can be used to improve the adhesion of photoresist on deposited nitride layer ?
- Polydimethylsiloxane
- Hexamethyldiazo-silazane
- Hexamethyldisilazane
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2. Which of the following process parameters influence thickness of film deposited by spin coating?
- Spin duration
- Only a
- Both a & b
Answer :-
3. Which alloy (smart material) was used for Shape Memory Alloy?
- HMDS
- Nitinol
- Nichrome
- Alnico
Answer :-
4. State whether the following statement is True/False:
“Xylene is used for the deparaffinising of tissues.”
- True
- False
Answer :-
5. Complete the following sentence:
“Transition states of shape memory alloy actuators such as nitinol are ………………
- Martensite and bainite phase
- Bainite and pearlite phase
- Austenite and martensite phase
Answer :-
6. Why are SMA called smart memory alloys?
- SMA regains its resistance when exposed to heat.
- SMA regains its electrical properties when exposed to heat.
- SMA regains its thermal conductivity when heated at a specific temperature.
- SMA regains its shape when heated.
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7. Identify the type of photoresist used in the process:

- Positive photoresist
- Negative photoresist
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8. What is the purpose of performing a dehydration bake?
- To remove sodium ion contamination generated by touching the wafer with a bare hand.
- To speed up photoresist coating.
- To remove moisture after the wafer cleaning process.
- To replace soft bake and hard bake.
Answer :-
9. Check if the statement is true or false:
“The photomask defect shown in the below figure is a chrome spot.”

- True
- False
Answer :-
10. Which of the following are the basic components of a Photoresist (PR)?
(A) Solvent (B) Developer (C) Sensitizer (D) Metal nanoparticles (E) Base material
- A, B, C, D, E
- A, B, D
- A, C, E
- A, C, D
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